Invention Grant
- Patent Title: Silicone gel composition
- Patent Title (中): 硅胶组合物
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Application No.: US11123193Application Date: 2005-05-06
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Publication No.: US07829648B2Publication Date: 2010-11-09
- Inventor: Miyuki Tanaka , Kazuyasu Sato
- Applicant: Miyuki Tanaka , Kazuyasu Sato
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-138451 20040507
- Main IPC: C08G77/00
- IPC: C08G77/00 ; C08G77/04

Abstract:
Provided is a silicone gel composition including (A) an organopolysiloxane containing at least one alkenyl group bonded to a silicon atom within each molecule, represented by an average composition formula: RaR1bSiO(4-a-b)/2 (wherein, each R group represents, independently, an alkenyl group, each R1 group represents, independently, an unsubstituted or substituted monovalent hydrocarbon group that contains no aliphatic unsaturated bonds, a represents a positive number from 0.0001 to 0.2, b represents a positive number from 1.7 to 2.2, and a+b represents a number within a range from 1.9 to 2.4), (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms within each molecule, and (C) a platinum-based catalyst. Also provided is the silicone gel composition stated above, in which a penetration value of a cured product of this composition, as defined in JIS K2220, is within a range from 20 to 200. The silicone gel composition generates a silicone gel cured product which displays a low elastic modulus and low stress, and suffers no oil bleeding over time.
Public/Granted literature
- US20050250903A1 Silicone gel composition Public/Granted day:2005-11-10
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