Invention Grant
US07829786B2 Sealing system and method for sealing a component within an electronic device
有权
用于密封电子设备内的部件的密封系统和方法
- Patent Title: Sealing system and method for sealing a component within an electronic device
- Patent Title (中): 用于密封电子设备内的部件的密封系统和方法
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Application No.: US11856866Application Date: 2007-09-18
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Publication No.: US07829786B2Publication Date: 2010-11-09
- Inventor: Robert M. Fuerstenberg , Christopher D. Crawford , Jorge L. Garcia , Jody H. Akens , Salvador P. Magana
- Applicant: Robert M. Fuerstenberg , Christopher D. Crawford , Jorge L. Garcia , Jody H. Akens , Salvador P. Magana
- Applicant Address: US IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: US IL Schaumburg
- Agent Randi L. Karpinia; Anthony P. Curtis
- Main IPC: H05K5/00
- IPC: H05K5/00
Abstract:
A sealing system for sealing a component (102) within an electronic device (100) is provided. The system includes one or more apertures (206) within an internal housing (202). Further the system includes an adhesive (602), adhered on a first surface to a ledge (502) and bottom perimeter surface 402 of the component. Furthermore, the system includes an external housing (204). The external housing presses the perimeter of the component onto the ledge.
Public/Granted literature
- US20090071748A1 SEALING SYSTEM AND METHOD FOR SEALING A COMPONENT WITHIN AN ELECTRONIC DEVICE Public/Granted day:2009-03-19
Information query
