Invention Grant
- Patent Title: Power feeding apparatus and harness wiring structure using the same
- Patent Title (中): 馈电装置和使用其的线束布线结构
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Application No.: US11959731Application Date: 2007-12-19
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Publication No.: US07829789B2Publication Date: 2010-11-09
- Inventor: Atsuyoshi Yamaguchi
- Applicant: Atsuyoshi Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-340800 20061219
- Main IPC: H02G3/04
- IPC: H02G3/04
Abstract:
A power feeding apparatus includes: a wire harness which includes a first portion, a second portion, and a bended portion connected to the first portion and the second portion, the bended portion has a substantially U-shape; a first protector which supports the first portion; and a second protector which supports the second portion. The second protector includes a guide portion having an opening. The guide portion receives the second portion so as to lead-out the second portion from the opening.
Public/Granted literature
- US20080142260A1 POWER FEEDING APPARATUS AND HARNESS WIRING STRUCTURE USING THE SAME Public/Granted day:2008-06-19
Information query
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