Invention Grant
- Patent Title: Circuit joining assembly materials for multi-layer lightning protection systems on composite aircraft
- Patent Title (中): 复合飞机上用于多层防雷系统的电路接合组装材料
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Application No.: US11935993Application Date: 2007-11-06
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Publication No.: US07829796B2Publication Date: 2010-11-09
- Inventor: David F. Feider , Ralph E. Dufresne , Quynhgiao N. Le
- Applicant: David F. Feider , Ralph E. Dufresne , Quynhgiao N. Le
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: H01R12/04
- IPC: H01R12/04

Abstract:
An exemplary embodiment provides a multi-layer circuit joining assembly material configured to repair multi-layer flex circuits deployed on or in a composite surface as a lightning protection system. The multi-layer circuit joining assembly material includes a first conductive layer having a first end portion, a second conductive layer having a second end portion, and a dielectric material between the first conductive layer and the second conductive layer.
Public/Granted literature
- US20090114427A1 CIRCUIT JOINING ASSEMBLY MATERIALS FOR MULTI-LAYER LIGHTNING PROTECTION SYSTEMS ON COMPOSITE AIRCRAFT Public/Granted day:2009-05-07
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