Invention Grant
- Patent Title: Method for manufacturing a miniaturized three-dimensional electric component
- Patent Title (中): 微型三维电气部件的制造方法
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Application No.: US11888571Application Date: 2007-07-31
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Publication No.: US07829799B2Publication Date: 2010-11-09
- Inventor: Tapani Ryhänen , Hans Otto Scheck , Ove Öhman , Olle Larsson , Michael Read , Tomas Lindström
- Applicant: Tapani Ryhänen , Hans Otto Scheck , Ove Öhman , Olle Larsson , Michael Read , Tomas Lindström
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Ware, Fressola, Van Der Sluys & Adolphson LLP
- Agent Alfred A. Fressola
- Main IPC: H01R13/502
- IPC: H01R13/502
Abstract:
Manufacturing of miniaturised three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided.
Public/Granted literature
- US20070267217A1 Method for manufacturing a miniaturized three-dimensional electric component Public/Granted day:2007-11-22
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