Invention Grant
US07829803B2 Enhanced key structure with combined keycap for a mobile computing device
有权
用于移动计算设备的组合键帽的增强型键结构
- Patent Title: Enhanced key structure with combined keycap for a mobile computing device
- Patent Title (中): 用于移动计算设备的组合键帽的增强型键结构
-
Application No.: US12406061Application Date: 2009-03-17
-
Publication No.: US07829803B2Publication Date: 2010-11-09
- Inventor: Mark Babella
- Applicant: Mark Babella
- Applicant Address: US CA Sunnyvale
- Assignee: Palm, Inc.
- Current Assignee: Palm, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Mahamedi Paradice Kreisman LLP
- Main IPC: H01H9/26
- IPC: H01H9/26 ; H01H13/72

Abstract:
A key structure assembly is provided for a mobile computing device. The key structure assembly includes a keycap having at least a first segment and a second segment. A first actuation member extends inward into the housing from the first segment of the keycap, and a second actuation member extends inward from the second segment of the key cap. A substrate including a plurality of electrical connects, including a first electrical contact aligned underneath the first actuation member, and a second electrical contact aligned underneath the second actuation member. The keycap is moveable inward to direct either the first actuation member into contact with the first electrical contact, or the second actuation member into contact with the second electrical contact. One or more sections of material are positioned above the first electrical contact and the second electrical contact. The material for the one or more sections is formed from a material that deforms with inward movement of either the first segment or the second segment of the keycap. A layer formed by a thickness of the one or more sections of material extending over the first electrical contact and the second electrical contact is non-uniform in either dimension or amount of material.
Public/Granted literature
- US20090173614A1 ENHANCED KEY STRUCTURE WITH COMBINED KEYCAP FOR A MOBILE COMPUTING DEVICE Public/Granted day:2009-07-09
Information query