Invention Grant
- Patent Title: Device for removing solder material from a soldered joint
- Patent Title (中): 用于从焊接接头去除焊料的装置
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Application No.: US10398784Application Date: 2001-10-02
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Publication No.: US07829817B2Publication Date: 2010-11-09
- Inventor: Elke Zakel , Paul Kasulke , Oliver Uebel , Lars Titerle
- Applicant: Elke Zakel , Paul Kasulke , Oliver Uebel , Lars Titerle
- Applicant Address: DE Nauen
- Assignee: Pac Tech-Packaging Technologies GmbH
- Current Assignee: Pac Tech-Packaging Technologies GmbH
- Current Assignee Address: DE Nauen
- Agent Ralph H. Dougherty
- International Application: PCT/EP01/11418 WO 20011002
- International Announcement: WO02/28582 WO 20020411
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.
Public/Granted literature
- US20040026383A1 Device for removing solder material from a soldered joint Public/Granted day:2004-02-12
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