Invention Grant
- Patent Title: Integrated circuit including U-shaped access device
- Patent Title (中): 集成电路包括U型接入装置
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Application No.: US12033519Application Date: 2008-02-19
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Publication No.: US07829879B2Publication Date: 2010-11-09
- Inventor: Rolf Weis , Thomas Happ
- Applicant: Rolf Weis , Thomas Happ
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L29/02
- IPC: H01L29/02
Abstract:
An integrated circuit includes a first contact, a second contact, and a U-shaped access device coupled to the first contact and the second contact. The integrated circuit includes self-aligned dielectric material isolating the first contact from the second contact.
Public/Granted literature
- US20090206315A1 INTEGRATED CIRCUIT INCLUDING U-SHAPED ACCESS DEVICE Public/Granted day:2009-08-20
Information query
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