Invention Grant
- Patent Title: Porous substrate and its manufacturing method, and gan semiconductor multilayer substrate and its manufacturing method
- Patent Title (中): 多孔基板及其制造方法及其半导体多层基板及其制造方法
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Application No.: US10519152Application Date: 2003-06-26
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Publication No.: US07829913B2Publication Date: 2010-11-09
- Inventor: Masatomo Shibata , Yuichi Oshima , Takeshi Eri , Akira Usui , Haruo Sunagawa
- Applicant: Masatomo Shibata , Yuichi Oshima , Takeshi Eri , Akira Usui , Haruo Sunagawa
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Hitachi Cable, Ltd.,NEC Corporation
- Current Assignee: Hitachi Cable, Ltd.,NEC Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2002-190270 20020628
- International Application: PCT/JP03/08173 WO 20030626
- International Announcement: WO2004/003266 WO 20040108
- Main IPC: H01L27/01
- IPC: H01L27/01

Abstract:
A structure of a substrate used for growing a crystal layer of a semiconductor, particularly a group-III nitride semiconductor and its manufacturing method. The substrate comprises two porous layers on a base. The mean opening diameter of the pores of the first porous laser, the outermost layer, is smaller than the means diameter of the pores in the second porous layer nearer to the base than the first porous layer. The first and second porous layers have volume porosities of 10 to 90%. More then 50% of the pores of the first porous layer extend from the surface of the first porous layer and reach the interface between the first and second porous layers. Even by a conventional crystal growing method, an epitaxial crystal of low defect density can be easily grown on the porous substrate.
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