Invention Grant
- Patent Title: Split charge storage node inner spacer process
- Patent Title (中): 分离电荷存储节点内隔离过程
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Application No.: US11873822Application Date: 2007-10-17
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Publication No.: US07829936B2Publication Date: 2010-11-09
- Inventor: Minghao Shen , Shenqing Fang , Wai Lo , Christie R. K. Marrian , Chungho Lee , Ning Cheng , Fred Cheung , Huaqiang Wu
- Applicant: Minghao Shen , Shenqing Fang , Wai Lo , Christie R. K. Marrian , Chungho Lee , Ning Cheng , Fred Cheung , Huaqiang Wu
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Turocy & Watson, LLP
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
Methods of forming a memory cell containing two split sub-lithographic charge storage nodes on a semiconductor substrate are provided. The methods can involve forming two split sub-lithographic charge storage nodes by using spacer formation techniques. By removing exposed portions of a first poly layer while leaving portions of the first poly layer protected by the spacers, the method can provide two split sub-lithographic first poly gates. Further, by removing exposed portions of a charge storage layer while leaving portions of the charge storage layer protected by the two split sub-lithographic first poly gates, the method can provide two split, narrow portions of the charge storage layer, which subsequently form two split sub-lithographic charge storage nodes.
Public/Granted literature
- US20090101963A1 SPLIT CHARGE STORAGE NODE INNER SPACER PROCESS Public/Granted day:2009-04-23
Information query
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