Invention Grant
US07829975B2 Multichip semiconductor device, chip therefor and method of formation thereof 有权
多芯片半导体器件,芯片及其形成方法

Multichip semiconductor device, chip therefor and method of formation thereof
Abstract:
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
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