Invention Grant
- Patent Title: Stacking quad pre-molded component packages, systems using the same, and methods of making the same
- Patent Title (中): 堆叠四预成型组件封装，使用其的系统及其制造方法
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Application No.: US12235227Application Date: 2008-09-22
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Publication No.: US07829988B2Publication Date: 2010-11-09
- Inventor: Yong Liu , Howard Allen , Qiuxiao Qian
- Applicant: Yong Liu , Howard Allen , Qiuxiao Qian
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.
Public/Granted literature
- US20100072590A1 Stacking Quad Pre-Molded Component Packages, Systems Using the Same, and Methods of Making the Same Public/Granted day:2010-03-25
Information query
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