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US07830008B2 Gold wire for connecting semiconductor chip 有权
用于连接半导体芯片的金线

Gold wire for connecting semiconductor chip
Abstract:
Gold wire for connecting a semiconductor chip basically containing praseodymium in 0.0004 mass % to 0.02 mass % in range and, considering the bonding characteristics, containing beryllium or aluminum or both in limited ranges and, considering the precipitates formed in the gold wire, further containing auxiliary additive elements of calcium, lanthanum, cerium, neodymium, and samarium in limited ranges.
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