Invention Grant
- Patent Title: Gold wire for connecting semiconductor chip
- Patent Title (中): 用于连接半导体芯片的金线
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Application No.: US11795921Application Date: 2006-01-24
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Publication No.: US07830008B2Publication Date: 2010-11-09
- Inventor: Keiichi Kimura , Tomohiro Uno
- Applicant: Keiichi Kimura , Tomohiro Uno
- Applicant Address: JP Tokyo
- Assignee: Nippon Steel Materials Co., Ltd.
- Current Assignee: Nippon Steel Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenyon & Kenyon LLP
- Priority: JP2005-015685 20050124; JP2006-001174 20060106
- International Application: PCT/JP2006/001384 WO 20060124
- International Announcement: WO2006/078076 WO 20060727
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
Gold wire for connecting a semiconductor chip basically containing praseodymium in 0.0004 mass % to 0.02 mass % in range and, considering the bonding characteristics, containing beryllium or aluminum or both in limited ranges and, considering the precipitates formed in the gold wire, further containing auxiliary additive elements of calcium, lanthanum, cerium, neodymium, and samarium in limited ranges.
Public/Granted literature
- US20080105975A1 Gold Wire for Connecting Semiconductor Chip Public/Granted day:2008-05-08
Information query
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