Invention Grant
- Patent Title: Elastic boundary wave device
- Patent Title (中): 弹性边界波装置
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Application No.: US12431427Application Date: 2009-04-28
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Publication No.: US07830067B2Publication Date: 2010-11-09
- Inventor: Satoru Matsuda , Michio Miura , Takashi Matsuda , Masanori Ueda
- Applicant: Satoru Matsuda , Michio Miura , Takashi Matsuda , Masanori Ueda
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Arent Fox LLP
- Priority: JP2006-061693 20060307
- Main IPC: H01L41/04
- IPC: H01L41/04
Abstract:
An elastic boundary wave device includes a first medium with piezoelectricity, an electrode exciting an elastic wave and provided on the first medium, a second medium made of a different material from the first medium and provided on the first medium to cover the electrode, and a sound absorbing portion provided on the second medium.
Public/Granted literature
- US20090212659A1 ELASTIC BOUNDARY WAVE DEVICE Public/Granted day:2009-08-27
Information query
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