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US07830162B2 Vertical probe and methods of fabricating and bonding the same 失效
垂直探头及其制造和粘接方法

  • Patent Title: Vertical probe and methods of fabricating and bonding the same
  • Patent Title (中): 垂直探头及其制造和粘接方法
  • Application No.: US11989940
    Application Date: 2006-07-19
  • Publication No.: US07830162B2
    Publication Date: 2010-11-09
  • Inventor: Oug-Ki Lee
  • Applicant: Oug-Ki Lee
  • Applicant Address: KR Seoul KR Seoul
  • Assignee: Phicom Corporation,Oug-Ki Lee
  • Current Assignee: Phicom Corporation,Oug-Ki Lee
  • Current Assignee Address: KR Seoul KR Seoul
  • Agency: Harness, Dickey & Pierce, P.L.C.
  • Priority: KR10-2005-0071115 20050803
  • International Application: PCT/KR2006/002830 WO 20060719
  • International Announcement: WO2007/015600 WO 20070208
  • Main IPC: G01R31/02
  • IPC: G01R31/02
Vertical probe and methods of fabricating and bonding the same
Abstract:
Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, And a bump connecting the contactor to the connector and buffing physical stress to the contactor.
Abstract(Chinese):

公开了一种垂直探针及其制造和粘合方法。 该探针由配备有两个尖端的接触器，与测量系统的测量端子电连接的连接器以及将接触器连接到连接器并将接触器的物理应力抛光的凸块组成。

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