Invention Grant
- Patent Title: Testing circuit board for testing devices under test
- Patent Title (中): 测试电路板用于测试设备
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Application No.: US12247040Application Date: 2008-10-07
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Publication No.: US07830163B2Publication Date: 2010-11-09
- Inventor: Cheng-Yung Teng , Li-Jieu Hsu , Wei-Fen Chiang , Yung-Yu Wu , Hung-Wei Chen , Huei-Huang Chen
- Applicant: Cheng-Yung Teng , Li-Jieu Hsu , Wei-Fen Chiang , Yung-Yu Wu , Hung-Wei Chen , Huei-Huang Chen
- Applicant Address: TW Taipei County
- Assignee: Princeton Technology Corporation
- Current Assignee: Princeton Technology Corporation
- Current Assignee Address: TW Taipei County
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW96218199U 20071030
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
The invention discloses a testing circuit board for placing a device under test and further testing the device under test according to a plurality of testing signals generated by a tester. The testing circuit board includes a circuit board and a plurality of sets of sockets. The circuit board includes a plurality of connecting holes. The plurality of sets of sockets are located on a plurality of connecting holes and electrically connects to the device under test via a plurality of connecting interfaces for transferring the plurality of testing signals to test the device under test.
Public/Granted literature
- US20090108859A1 TESTING CIRCUIT BOARD Public/Granted day:2009-04-30
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