Invention Grant
- Patent Title: Wireless IC device and electronic device
- Patent Title (中): 无线IC器件和电子设备
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Application No.: US11851661Application Date: 2007-09-07
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Publication No.: US07830311B2Publication Date: 2010-11-09
- Inventor: Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura
- Applicant: Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-186392 20070718
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.
Public/Granted literature
- US20090021446A1 WIRELESS IC DEVICE AND ELECTRONIC DEVICE Public/Granted day:2009-01-22
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