Invention Grant
- Patent Title: Flexible wiring substrate and method for producing the same
- Patent Title (中): 柔性布线基板及其制造方法
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Application No.: US12039073Application Date: 2008-02-28
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Publication No.: US07830667B2Publication Date: 2010-11-09
- Inventor: Hiroaki Kurihara
- Applicant: Hiroaki Kurihara
- Applicant Address: JP Tokyo
- Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.
Public/Granted literature
- US20080174975A1 FLEXIBLE WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2008-07-24
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