Invention Grant
US07830940B2 Nitride semiconductor laser element having nitride semiconductor substrate and nitride semiconductor layer laminated thereon with nitride semiconductor substrate and nitride semiconductor layer having recesses formed in high dislocation density region of nitride semiconductor substrate and nitride semiconductor layer having portions with different film thicknesses 有权
具有氮化物半导体衬底的氮化物半导体激光元件和层叠有氮化物半导体衬底的氮化物半导体层和在氮化物半导体衬底的高位错密度区域中形成的凹部的氮化物半导体层和具有不同膜厚度的部分的氮化物半导体层

  • Patent Title: Nitride semiconductor laser element having nitride semiconductor substrate and nitride semiconductor layer laminated thereon with nitride semiconductor substrate and nitride semiconductor layer having recesses formed in high dislocation density region of nitride semiconductor substrate and nitride semiconductor layer having portions with different film thicknesses
  • Patent Title (中): 具有氮化物半导体衬底的氮化物半导体激光元件和层叠有氮化物半导体衬底的氮化物半导体层和在氮化物半导体衬底的高位错密度区域中形成的凹部的氮化物半导体层和具有不同膜厚度的部分的氮化物半导体层
  • Application No.: US11849734
    Application Date: 2007-09-04
  • Publication No.: US07830940B2
    Publication Date: 2010-11-09
  • Inventor: Shingo MasuiTomonori Morizumi
  • Applicant: Shingo MasuiTomonori Morizumi
  • Applicant Address: JP Anan-shi
  • Assignee: Nichia Corporation
  • Current Assignee: Nichia Corporation
  • Current Assignee Address: JP Anan-shi
  • Agency: Global IP Counselors, LLP
  • Priority: JP2006-239161 20060904; JP2007-225572 20070831
  • Main IPC: H01S5/00
  • IPC: H01S5/00 H01L23/58
Nitride semiconductor laser element having nitride semiconductor substrate and nitride semiconductor layer laminated thereon with nitride semiconductor substrate and nitride semiconductor layer having recesses formed in high dislocation density region of nitride semiconductor substrate and nitride semiconductor layer having portions with different film thicknesses
Abstract:
A nitride semiconductor laser element comprises a nitride semiconductor substrate and a nitride semiconductor layer laminated thereon, wherein the nitride semiconductor substrate has a high dislocation density region and a low dislocation density region containing lower dislocation than that of the high dislocation density region, and has at least one recess formed in at least the high dislocation density region, the nitride semiconductor layer has a first nitride semiconductor layer in which the grown film thickness in the lateral direction from the side faces of the recess in the substrate is greater than the grown film thickness in the heightwise direction from a region other than the recess, and a second nitride semiconductor layer that is disposed on the first nitride semiconductor layer and contains indium, and the first nitride semiconductor layer and second nitride semiconductor layer have recess over the recess in the nitride semiconductor substrate.
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