Invention Grant
- Patent Title: Microphotonic waveguide including core/cladding interface layer
- Patent Title (中): 微波导管包括芯/包层界面层
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Application No.: US11899234Application Date: 2007-09-05
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Publication No.: US07831123B2Publication Date: 2010-11-09
- Inventor: Daniel K. Sparacin , Anuradha M. Agarwal , Pradip K. Roy , Lionel C. Kimerling
- Applicant: Daniel K. Sparacin , Anuradha M. Agarwal , Pradip K. Roy , Lionel C. Kimerling
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agent Theresa A. Lober
- Main IPC: G02B6/10
- IPC: G02B6/10

Abstract:
The invention provides a waveguide with a waveguide core having longitudinal sidewall surfaces, a longitudinal top surface, and a longitudinal bottom surface that is disposed on a substrate. An interface layer is disposed on at least one longitudinal sidewall surface of the waveguide core. A waveguide cladding layer is disposed on at least the waveguide core sidewall and top surfaces, over the interface layer. The waveguide of the invention can be produced by forming a waveguide undercladding layer on a substrate, and then forming a waveguide core on the undercladding layer. An interface layer is then formed on at least a longitudinal sidewall surface of the waveguide core, and an upper cladding layer is formed on a longitudinal top surface and on longitudinal sidewall surfaces of the waveguide core, over the interface layer.
Public/Granted literature
- US20080253728A1 Microphotonic waveguide including core/cladding interface layer Public/Granted day:2008-10-16
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