Invention Grant
- Patent Title: Charged particle beam lithography system and method for evaluating the same
- Patent Title (中): 带电粒子束光刻系统及其评估方法
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Application No.: US11855613Application Date: 2007-09-14
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Publication No.: US07834333B2Publication Date: 2010-11-16
- Inventor: Rieko Nishimura , Shuichi Tamamushi
- Applicant: Rieko Nishimura , Shuichi Tamamushi
- Applicant Address: JP Numazu-shi
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Numazu-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-250316 20060915
- Main IPC: G21K5/02
- IPC: G21K5/02

Abstract:
In the charged particle beam lithography system, a pattern area to be drawn is divided into a plurality of frames, a main deflection positions a charged particle beam to a subfield within the frame, and an auxiliary deflection draws a pattern in units of the subfield. The charged particle beam lithography system includes a beam optical system including a deflector deflecting the beam, a driver driving the deflector, and a deflection control portion controlling the driver according to drawing data indicating a pattern to be drawn. The deflection control portion controls the driver according to a settling time that is determined so that an offset of an irradiation position of the charged particle beam has a certain value irrespective of any changes in deflection amount of the auxiliary deflection in the subfield.
Public/Granted literature
- US20080067338A1 CHARGED PARTICLE BEAM LITHOGRAPHY SYSTEM AND METHOD FOR EVALUATING THE SAME Public/Granted day:2008-03-20
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