Invention Grant
- Patent Title: Electronic device and method for coping with electrostatic discharge
- Patent Title (中): 用于应对静电放电的电子设备和方法
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Application No.: US12415657Application Date: 2009-03-31
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Publication No.: US07834446B2Publication Date: 2010-11-16
- Inventor: Takashi Yajima , Masayuki Gamou
- Applicant: Takashi Yajima , Masayuki Gamou
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, L.L.P.
- Priority: JPP2008-226421 20080903
- Main IPC: H01L23/40
- IPC: H01L23/40
Abstract:
According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.
Public/Granted literature
- US20100052158A1 ELECTRONIC DEVICE AND METHOD FOR COPING WITH ELECTROSTATIC DISCHARGE Public/Granted day:2010-03-04
Information query
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