Invention Grant
- Patent Title: Multilayer electronic component systems and methods of manufacture
- Patent Title (中): 多层电子元件系统及制造方法
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Application No.: US11993890Application Date: 2005-11-23
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Publication No.: US07834808B2Publication Date: 2010-11-16
- Inventor: Dane Thompson , Guoan Wang , Nickolas D. Kingsley , Ioannis Papapolymerou , Emmanouil M. Tentzeris , Ramanan Bairavasubramanian , Gerald DeJean , RongLin Li
- Applicant: Dane Thompson , Guoan Wang , Nickolas D. Kingsley , Ioannis Papapolymerou , Emmanouil M. Tentzeris , Ramanan Bairavasubramanian , Gerald DeJean , RongLin Li
- Applicant Address: US GA Atlanta
- Assignee: Georgia Tech Research Corporation
- Current Assignee: Georgia Tech Research Corporation
- Current Assignee Address: US GA Atlanta
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- International Application: PCT/US2005/042749 WO 20051123
- International Announcement: WO2008/030208 WO 20080313
- Main IPC: H01Q1/38
- IPC: H01Q1/38
Abstract:
Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
Public/Granted literature
- US20100090902A1 MULTILAYER ELECTRONIC COMPONENT SYSTEMS AND METHODS OF MANUFACTURE Public/Granted day:2010-04-15
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