Invention Grant
- Patent Title: Computer enclosure with airflow guide
- Patent Title (中): 带气流导向器的电脑外壳
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Application No.: US12341395Application Date: 2008-12-22
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Publication No.: US07835149B2Publication Date: 2010-11-16
- Inventor: Yang Li , Yu-Hsu Lin , Jeng-Da Wu , Lei Guo , Liang-Liang Cao , Liang-Qing Shan
- Applicant: Yang Li , Yu-Hsu Lin , Jeng-Da Wu , Lei Guo , Liang-Liang Cao , Liang-Qing Shan
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Clifford O. Chi
- Priority: CN200820302523 20081022
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
Public/Granted literature
- US20100097754A1 COMPUTER ENCLOSURE WITH AIRFLOW GUIDE Public/Granted day:2010-04-22
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