Invention Grant
- Patent Title: Method and apparatus for processing material
- Patent Title (中): 加工材料的方法和装置
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Application No.: US12005116Application Date: 2007-12-21
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Publication No.: US07835808B2Publication Date: 2010-11-16
- Inventor: Philip P. Sawyer , David A. Morgan , David Lee
- Applicant: Philip P. Sawyer , David A. Morgan , David Lee
- Applicant Address: US WA Vancouver
- Assignee: Precision Automation, Inc.
- Current Assignee: Precision Automation, Inc.
- Current Assignee Address: US WA Vancouver
- Agency: Kolisch Hartwell, P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B26D7/06

Abstract:
A system, including apparatus and method, for processing material includes a computer connected to a saw. A pusher is used to convey material along a processing path. The computer is programmed to control optimal processing of material to satisfy a cut list. The system for processing material may further include a printer configured to print labels for application to work pieces processed by the system.
Public/Granted literature
- US20090100974A1 Method and apparatus for processing material Public/Granted day:2009-04-23
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