Invention Grant
US07837477B2 Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity
有权
电子互连器件包含用于减少电容性短截线的Fedundant接点和改善的信号完整性
- Patent Title: Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity
- Patent Title (中): 电子互连器件包含用于减少电容性短截线的Fedundant接点和改善的信号完整性
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Application No.: US12651970Application Date: 2010-01-04
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Publication No.: US07837477B2Publication Date: 2010-11-23
- Inventor: Gary Yasamura , Joseph C. Fjelstad , Kevin P. Grundy , William F. Wiedemann , Matthew J. Stepovich
- Applicant: Gary Yasamura , Joseph C. Fjelstad , Kevin P. Grundy , William F. Wiedemann , Matthew J. Stepovich
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
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