Invention Grant
- Patent Title: Semiconductor structure with solder bumps
- Patent Title (中): 具有焊料凸块的半导体结构
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Application No.: US12015447Application Date: 2008-01-16
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Publication No.: US07838954B2Publication Date: 2010-11-23
- Inventor: Stephen L Buchwalter , Peter A Gruber , Jae-Woong Nah , Da-Yuan Shih
- Applicant: Stephen L Buchwalter , Peter A Gruber , Jae-Woong Nah , Da-Yuan Shih
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Nugent & Smith, LLP
- Agent Theresa O'Rourke Nugent
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
Public/Granted literature
- US20090181223A1 METHOD OF FABRICATING SOLDER BUMPS Public/Granted day:2009-07-16
Information query
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