Invention Grant
US07838976B2 Semiconductor device having a semiconductor chip enclosed by a body structure and a base
有权
半导体器件具有由体结构和基底封装的半导体芯片
- Patent Title: Semiconductor device having a semiconductor chip enclosed by a body structure and a base
- Patent Title (中): 半导体器件具有由体结构和基底封装的半导体芯片
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Application No.: US11878510Application Date: 2007-07-25
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Publication No.: US07838976B2Publication Date: 2010-11-23
- Inventor: Shunpei Yamazaki , Yasuyuki Arai
- Applicant: Shunpei Yamazaki , Yasuyuki Arai
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2006-206798 20060728
- Main IPC: H01L23/06
- IPC: H01L23/06 ; H01L23/043
Abstract:
In inlets used for ID tags and the like, a defective connection between an integrated circuit part and an antenna is suppressed by improvement of tolerance for a bending or a pressing pressure. The integrated circuit part includes a semiconductor chip and a multilayer substrate having a concave portion. The semiconductor chip is mounted on the bottom of the concave portion. The multilayer substrate includes a connection electrode at the top surface and a connection electrode connected to the semiconductor chip on the bottom of the concave portion. The connection electrode on the bottom of the concave portion is connected to the connection electrode at the top surface by a penetration electrode inside a multilayer substrate. By such a configuration, the semiconductor chip is connected to the antenna.
Public/Granted literature
- US20080023810A1 Semiconductor device Public/Granted day:2008-01-31
Information query
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