Invention Grant
- Patent Title: Condenser for power module and power module
- Patent Title (中): 电源模块和电源模块的冷凝器
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Application No.: US12297894Application Date: 2008-02-25
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Publication No.: US07839641B2Publication Date: 2010-11-23
- Inventor: Youichiro Baba , Hideo Nakamura
- Applicant: Youichiro Baba , Hideo Nakamura
- Applicant Address: JP Toyota-shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi
- Agency: Kenyon & Kenyon LLP
- Priority: JP2007-133981 20070521
- International Application: PCT/JP2008/053711 WO 20080225
- International Announcement: WO2008/142892 WO 20081127
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; F28D15/00

Abstract:
A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is possible to adopt a configuration with a complex concave-convex configuration for a superior heat radiation performance. A channel for coolant with high heat radiation performance can also be structured inside the casing. The relatively thick bottom plate secures the rigidity required by the casing, while the relatively thin top plate can have a rigidity intentionally structured lower. In this manner, stress generated on joining surfaces of the condenser and an insulative substrate can be mitigated due to active deformation of the top plate.
Public/Granted literature
- US20100170662A1 CONDENSER FOR POWER MODULE AND POWER MODULE Public/Granted day:2010-07-08
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