Invention Grant
US07839650B2 Circuit board structure having embedded capacitor and fabrication method thereof
失效
具有嵌入式电容器的电路板结构及其制造方法
- Patent Title: Circuit board structure having embedded capacitor and fabrication method thereof
- Patent Title (中): 具有嵌入式电容器的电路板结构及其制造方法
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Application No.: US11977780Application Date: 2007-10-25
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Publication No.: US07839650B2Publication Date: 2010-11-23
- Inventor: Shih-Ping Hsu
- Applicant: Shih-Ping Hsu
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Morrison & Foerster LLP
- Priority: TW95139297A 20061025
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
The present invention provides a circuit board structure having an embedded capacitor and a method for fabricating the same. The circuit board structure includes a core layer board with at least one surface having non-penetrating first and second grooves, a circuit layer and a first electrode plate formed in the first and second grooves of the core layer board respectively and being flush with the core layer board; a high dielectric material layer formed on the core layer board, the circuit layer and the first electrode plate; a second electrode plate formed on the high dielectric material layer and corresponding to the first electrode plate, thereby forming a capacitor by the first and second electrode plates and the high dielectric material layer. The high dielectric material layer is formed on a plane surface so as to eliminate poor filling and improve reliability.
Public/Granted literature
- US20080264677A1 Circuit board structure having embedded capacitor and fabrication method thereof Public/Granted day:2008-10-30
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