Invention Grant
- Patent Title: Composition for removing an insulation material and related methods
- Patent Title (中): 去除绝缘材料的组成和相关方法
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Application No.: US12494572Application Date: 2009-06-30
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Publication No.: US07842623B2Publication Date: 2010-11-30
- Inventor: Chun-Deuk Lee , Jung-Jea Myung , Myun-Kyu Park , Dong-Min Kang , Byoung-Woo Son , Masayuki Takashima , Young-Nam Kim , Hyun-Joon Kim
- Applicant: Chun-Deuk Lee , Jung-Jea Myung , Myun-Kyu Park , Dong-Min Kang , Byoung-Woo Son , Masayuki Takashima , Young-Nam Kim , Hyun-Joon Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2005-0072471 20050808
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C11D7/32
Abstract:
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
Public/Granted literature
- US20090305931A1 COMPOSITION FOR REMOVING AN INSULATION MATERIAL AND RELATED METHODS Public/Granted day:2009-12-10
Information query
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