Invention Grant
- Patent Title: Small size transistor semiconductor device capable of withstanding high voltage
- Patent Title (中): 能承受高电压的小尺寸晶体管半导体器件
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Application No.: US12085669Application Date: 2006-11-29
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Publication No.: US07843014B2Publication Date: 2010-11-30
- Inventor: Yuji Fukui , Kazuhiko Yoshino , Satoshi Hikida , Shuhji Enomoto
- Applicant: Yuji Fukui , Kazuhiko Yoshino , Satoshi Hikida , Shuhji Enomoto
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-344660 20051129; JP2006-081407 20060323
- International Application: PCT/JP2006/323835 WO 20061129
- International Announcement: WO2007/063908 WO 20070607
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L23/48

Abstract:
In one embodiment of the present invention, a high withstand voltage transistor is disclosed having small sizes including an element isolating region. The semiconductor device is provided with the element isolating region formed on a semiconductor substrate; an active region demarcated by the element isolating region; a gate electrode formed on the semiconductor substrate in the active region by having a gate insulating film in between; a channel region arranged in the semiconductor substrate under the gate electrode; a source region and a drain region positioned on the both sides of the gate electrode; and a drift region positioned between one of or both of the source region and the drain region and the channel region. One of or both of the source region and the drain region are at least partially positioned on the element isolating region, and are connected with the channel region through the drift region.
Public/Granted literature
- US20080277723A1 Semiconductor Device Public/Granted day:2008-11-13
Information query
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