Invention Grant
US07843026B2 Composite material with conductive structures of random size, shape, orientation, or location
有权
具有随机尺寸，形状，取向或位置的导电结构的复合材料
- Patent Title: Composite material with conductive structures of random size, shape, orientation, or location
- Patent Title (中): 具有随机尺寸，形状，取向或位置的导电结构的复合材料
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Application No.: US11290685Application Date: 2005-11-30
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Publication No.: US07843026B2Publication Date: 2010-11-30
- Inventor: Shih-Yuan Wang , Alexandre Bratkovski
- Applicant: Shih-Yuan Wang , Alexandre Bratkovski
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L31/0232
Abstract:
A composite material with at least one of a negative effective permittivity and a negative effective permeability for incident radiation of at least one wavelength is described. The composite material comprises conductive structures that are substantially random with respect to at least one of size, shape, orientation, and location.
Public/Granted literature
- US20070120114A1 Composite material with conductive structures of random size, shape, orientation, or location Public/Granted day:2007-05-31
Information query
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