Invention Grant
- Patent Title: Flip chip packages with spacers separating heat sinks and substrates
- Patent Title (中): 倒装芯片封装，分隔散热片和基板
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Application No.: US11928971Application Date: 2007-10-30
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Publication No.: US07843058B2Publication Date: 2010-11-30
- Inventor: Pei-Haw Tsao , Liang-Chen Lin , Pao-Kang Niu
- Applicant: Pei-Haw Tsao , Liang-Chen Lin , Pao-Kang Niu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.
Public/Granted literature
- US20090108429A1 Flip Chip Packages with Spacers Separating Heat Sinks and Substrates Public/Granted day:2009-04-30
Information query
IPC分类:
