Invention Grant
- Patent Title: Flash memory devices having three dimensional stack structures and methods of driving same
- Patent Title (中): 具有三维堆栈结构的闪存器件及其驱动方法
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Application No.: US12136933Application Date: 2008-06-11
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Publication No.: US07843733B2Publication Date: 2010-11-30
- Inventor: Doo-gon Kim , Ki-tae Park , Yeong-taek Lee
- Applicant: Doo-gon Kim , Ki-tae Park , Yeong-taek Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR2007-57517 20070612
- Main IPC: G11C16/04
- IPC: G11C16/04

Abstract:
Flash memory devices are provided including a plurality of layers stacked vertically. Each of the plurality of layers include a plurality of memory cells. A row decoder is electrically coupled to the plurality of layers and configured to supply a wordline voltage to the plurality of layers. Memory cells provided in at least two layers of the plurality of layers belong to a same memory block and wordlines associated with the memory cells in the at least two layers of the plurality of layers are electrically coupled.
Public/Granted literature
- US20080310230A1 Flash Memory Devices Having Three Dimensional Stack Structures and Methods of Driving Same Public/Granted day:2008-12-18
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