Invention Grant
- Patent Title: Electronic apparatus and method of manufacturing electronic apparatus
- Patent Title (中): 电子设备及其制造方法
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Application No.: US11604377Application Date: 2006-11-27
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Publication No.: US07844226B2Publication Date: 2010-11-30
- Inventor: Shigemi Kurashima , Masahiro Yanagi , Hideki Iwata , Takashi Yuba , Masahiro Kaneko , Yuriko Segawa , Takashi Arita
- Applicant: Shigemi Kurashima , Masahiro Yanagi , Hideki Iwata , Takashi Yuba , Masahiro Kaneko , Yuriko Segawa , Takashi Arita
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2006-091604 20060329
- Main IPC: H04B17/00
- IPC: H04B17/00
Abstract:
The present invention discloses a method of manufacturing an electronic apparatus for wireless communications in that the method includes the steps of arranging an antenna apparatus adjacent to the electronic apparatus formed on a substrate and testing the electronic apparatus by conducting the wireless communications between the electronic apparatus and the antenna apparatus.
Public/Granted literature
- US20070231937A1 Electronic apparatus and method of manufacturing electronic apparatus Public/Granted day:2007-10-04
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