Invention Grant
- Patent Title: Mask pattern correction program and system
- Patent Title (中): 掩模图案校正程序和系统
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Application No.: US11939223Application Date: 2007-11-13
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Publication No.: US07844939B2Publication Date: 2010-11-30
- Inventor: Reiko Tsutsui , Hidetoshi Oishi
- Applicant: Reiko Tsutsui , Hidetoshi Oishi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2006-311111 20061117
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G03F5/00 ; G21K1/00 ; G06K9/00

Abstract:
The present invention provides a mask pattern correction program for correcting a design pattern which serves as a source to form a mask pattern so that, by exposure of a mask with a pattern formed thereon onto a substrate, the mask pattern is transferred as designed, the mask pattern correction program including performing, on a computer, the steps of: determining, before simulation of the dimension of the pattern transferred by exposure, whether the simulation result will converge; and classifying design pattern edges into first and second target edges, correct the first target edges and perform simulation thereon if it is determined that the simulation result will not converge.
Public/Granted literature
- US20080120589A1 MASK PATTERN CORRECTION PROGRAM AND SYSTEM Public/Granted day:2008-05-22
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