Invention Grant
- Patent Title: System and method for dressing a wafer polishing pad
- Patent Title (中): 用于修整晶片抛光垫的系统和方法
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Application No.: US12351290Application Date: 2009-01-09
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Publication No.: US07846007B2Publication Date: 2010-12-07
- Inventor: Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
- Applicant: Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
- Applicant Address: US MO St. Peters
- Assignee: MEMC Electronic Materials, Inc.
- Current Assignee: MEMC Electronic Materials, Inc.
- Current Assignee Address: US MO St. Peters
- Agency: Armstrong Teasdale LLP
- Main IPC: B24B49/00
- IPC: B24B49/00 ; B24B51/00
Abstract:
A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
Public/Granted literature
- US20090176441A1 SYSTEM AND METHOD FOR DRESSING A WAFER POLISHING PAD Public/Granted day:2009-07-09
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