Invention Grant
- Patent Title: Method of making alloys having low coefficient of thermal expansion
- Patent Title (中): 制造热膨胀系数低的合金的方法
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Application No.: US11742732Application Date: 2007-05-01
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Publication No.: US07846276B2Publication Date: 2010-12-07
- Inventor: David R. Hasek , Thomas R. Parayil
- Applicant: David R. Hasek , Thomas R. Parayil
- Applicant Address: US OR Albany
- Assignee: ATI Properties, Inc.
- Current Assignee: ATI Properties, Inc.
- Current Assignee Address: US OR Albany
- Agency: K & L Gates LLP
- Agent Patrick J. Viccaro; John E. Grosselin, III
- Main IPC: C21D7/02
- IPC: C21D7/02 ; C21D8/02
Abstract:
The present disclosure provides alloys having an ultra-low coefficient of thermal expansion in the range of 60° F. to 80° F. The alloys have coefficient of thermal expansion no greater than 0.35×10−6° F.−1 in the range of 60° F. to 80° F. Methods of making such alloys also are provided, as well articles of manufacture including such alloys and methods of making such articles.
Public/Granted literature
- US20070264150A1 Alloys having low coefficient of thermal expansion and methods of making same Public/Granted day:2007-11-15
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