Invention Grant
- Patent Title: Processing a printed wiring board by single bath electrodeposition
- Patent Title (中): 通过单浴电沉积处理印刷电路板
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Application No.: US10373350Application Date: 2003-02-24
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Publication No.: US07846317B2Publication Date: 2010-12-07
- Inventor: Michael P. Meltzer , Christopher P. Steffani , Ray A. Gonfiotti
- Applicant: Michael P. Meltzer , Christopher P. Steffani , Ray A. Gonfiotti
- Applicant Address: US CA Livermore
- Assignee: Lawrence Livermore National Security, LLC
- Current Assignee: Lawrence Livermore National Security, LLC
- Current Assignee Address: US CA Livermore
- Agent Eddie E. Scott; John H. Lee
- Main IPC: C25D5/10
- IPC: C25D5/10 ; B32B3/00
Abstract:
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Public/Granted literature
- US20030150742A1 Processing a printed wiring board by single bath electrodeposition Public/Granted day:2003-08-14
Information query
