Invention Grant
- Patent Title: Connection structure with a workpiece and an object
- Patent Title (中): 与工件和物体的连接结构
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Application No.: US11559884Application Date: 2006-11-14
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Publication No.: US07846538B2Publication Date: 2010-12-07
- Inventor: Hun-Jen Chen , Li-Yen Liu , Hsiu-Yu Fan , Tsun-Wu Liu
- Applicant: Hun-Jen Chen , Li-Yen Liu , Hsiu-Yu Fan , Tsun-Wu Liu
- Applicant Address: TW Jung-He, Taipei Hsien
- Assignee: Micro-Star Int'l Co. Ltd.
- Current Assignee: Micro-Star Int'l Co. Ltd.
- Current Assignee Address: TW Jung-He, Taipei Hsien
- Agency: Winston Hsu
- Agent Scott Margo
- Priority: TW95214730U 20060818
- Main IPC: B23P5/00
- IPC: B23P5/00
Abstract:
A connection structure includes a workpiece, and a coating layer disposed above the workpiece. A groove is formed on a surface of the coating layer. The connection structure further includes an object installed inside the groove and adhered to the workpiece.
Public/Granted literature
- US20080041101A1 CONNECTION STRUCTURE WITH A WORKPIECE AND AN OBJECT Public/Granted day:2008-02-21
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