Invention Grant
- Patent Title: Insulation-coated conductive particle
- Patent Title (中): 绝缘涂层导电颗粒
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Application No.: US10565477Application Date: 2004-06-09
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Publication No.: US07846547B2Publication Date: 2010-12-07
- Inventor: Misao Konishi
- Applicant: Misao Konishi
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2003-295666 20030819
- International Application: PCT/JP2004/008024 WO 20040609
- International Announcement: WO2005/017923 WO 20050224
- Main IPC: B32B5/16
- IPC: B32B5/16

Abstract:
To provide both an excellent solvent-resistance and a conduction reliability to an insulation coated conductive particle that is suitable for use as a conductive particle in an anisotropic conductive adhesive, the insulation coated conductive particle is configured such that the surface of a conductive particle is coated with an insulating resin layer formed of an insulating resin having a carboxyl group, and the insulating resin layer is surface-treated with a polyfunctional aziridine compound. Examples of the aziridine compound include trimethylolpropane-tri-β-aziridinylpropionate, tetramethylolmethane-tri-β-aziridinylpropionate, and N,N-hexamethylene-1, 6-bis-1-aziridinecarboxamide. The insulating resin layer is preferably composed of an insulating resin having an acrylic acid monomer unit or a methacrylic acid monomer unit. Specifically, the preferable insulating resin is an acrylic acid-styrene copolymer.
Public/Granted literature
- US20060261315A1 Insulation-coated electroconductive particles Public/Granted day:2006-11-23
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