Invention Grant
- Patent Title: Semiconductor imaging device and fabrication process thereof
- Patent Title (中): 半导体成像装置及其制造方法
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Application No.: US12292234Application Date: 2008-11-14
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Publication No.: US07846758B2Publication Date: 2010-12-07
- Inventor: Narumi Ohkawa
- Applicant: Narumi Ohkawa
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-220131 20050729
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor imaging device includes a photodetection region formed of a diffusion region of a first conductivity type formed in an active region of a silicon substrate at a first side of a gate electrode such that a top part thereof is separated from a surface of the silicon substrate and such that an inner edge part invades underneath a channel region right underneath the gate electrode, a shielding layer formed of a second conductivity type at a surface of the silicon substrate at the first side of the gate electrode such that an inner edge part thereof is aligned with a sidewall surface of the gate electrode at the first side, a floating diffusion region formed in the active region at a second side of the gate electrode, and a channel region formed right underneath said gate electrode, wherein the channel region includes a first channel region part formed adjacent to the shielding layer and a second channel region part formed adjacent to the floating diffusion region, wherein the second channel region part contains an impurity element with a concentration level lower than the impurity concentration level of the first channel region part.
Public/Granted literature
- US20090075416A1 Semiconductor imaging device and fabrication process thereof Public/Granted day:2009-03-19
Information query
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