Flip-chip package covered with tape

Invention Grant

US07846780B2 Flip-chip package covered with tape 有权

Title translation: 倒装芯片封装用胶带覆盖

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Patent Title: Flip-chip package covered with tape
Patent Title (中): 倒装芯片封装用胶带覆盖
Application No.: US12012388

Application Date: 2008-02-01
Publication No.: US07846780B2

Publication Date: 2010-12-07
Inventor: Naomi Masuda
Applicant: Naomi Masuda
Applicant Address: US CA Sunnyvale
Assignee: Spansion LLC
Current Assignee: Spansion LLC
Current Assignee Address: US CA Sunnyvale
Priority: JP2007-023913 20070202
Main IPC: H01L21/56
IPC: H01L21/56

Abstract:

A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.

Abstract(Chinese):

半导体器件的制造方法包括将熔融树脂布置在基板上，将半导体芯片布置在熔融树脂上，将半导体芯片按压并将半导体芯片倒装安装在基板上，并用熔融树脂硬化熔融树脂经受流体压力并形成树脂部分。

Public/Granted literature

US20090039531A1 Flip-chip package covered with tape Public/Granted day:2009-02-12

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/50	...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的
H01L21/56	....封装，例如密封层、涂层