Invention Grant
- Patent Title: Tunnel insulating layer of flash memory device and method of forming the same
- Patent Title (中): 闪存器件的隧道绝缘层及其形成方法
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Application No.: US12345617Application Date: 2008-12-29
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Publication No.: US07846797B2Publication Date: 2010-12-07
- Inventor: Kwon Hong
- Applicant: Kwon Hong
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2008-0000076 20080102
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The present invention discloses a tunnel insulating layer in a flash memory device and a method of forming the same, the method according to the present invention comprises the steps of forming a first oxide layer on a semiconductor substrate through a first oxidation process; forming a nitride layer on an interface between the semiconductor substrate and the first oxide layer through a first nitridation process; forming a second nitride layer on the first oxide layer through a second nitridation process; forming a second oxide layer on the second nitride layer through a second oxidation process; and forming a third nitride layer on the second oxide layer through a third nitridation process.
Public/Granted literature
- US20090166711A1 Tunnel Insulating Layer of Flash Memory Device and Method of Forming the Same Public/Granted day:2009-07-02
Information query
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