Invention Grant
- Patent Title: Method and apparatus for bonded substrates
- Patent Title (中): 粘合基材的方法和装置
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Application No.: US12025514Application Date: 2008-02-04
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Publication No.: US07846813B2Publication Date: 2010-12-07
- Inventor: Yuri V. Sokolov , Donald Roy , Tyler Hook
- Applicant: Yuri V. Sokolov , Donald Roy , Tyler Hook
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
A method for forming bonded substrates includes providing a plurality of substrates, each of which having a top surface. A characteristic length for each of the plurality of substrates is determined by: determining a topographical profile of the top surface of the substrate from an interior portion to an edge portion along a radial direction, determining a highest point of the profile, and defining the characteristic length as a distance from the highest point to the edge portion. A first substrate and a second substrate are selected where at least one of the first or the second substrates has a characteristic length shorter than a predetermined length. The first substrate and the second substrate are brought into contact and form bonded substrates, with the top surface of the first substrate facing the top surface of the second substrate.
Public/Granted literature
- US20090197053A1 METHOD AND APPARATUS FOR BONDED SUBSTRATES Public/Granted day:2009-08-06
Information query
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