Invention Grant
US07846829B2 Stacked solder balls for integrated circuit device packaging and assembly
有权
用于集成电路器件封装和组装的堆叠焊球
- Patent Title: Stacked solder balls for integrated circuit device packaging and assembly
- Patent Title (中): 用于集成电路器件封装和组装的堆叠焊球
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Application No.: US12196210Application Date: 2008-08-21
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Publication No.: US07846829B2Publication Date: 2010-12-07
- Inventor: Junji Tanaka , Masahiko Harayama , Masanori Onodera
- Applicant: Junji Tanaka , Masahiko Harayama , Masanori Onodera
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Priority: JP2007-215189 20070821
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/52 ; H01L23/48 ; H01L29/40 ; H01L23/485 ; H01L23/498
Abstract:
A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved.
Public/Granted literature
- US20090212423A1 STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND ASSEMBLY Public/Granted day:2009-08-27
Information query
IPC分类:
