Invention Grant
- Patent Title: Multi-layered platelet structure
- Patent Title (中): 多层血小板结构
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Application No.: US11656726Application Date: 2007-01-23
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Publication No.: US07846853B2Publication Date: 2010-12-07
- Inventor: Gary Stevens , James D. B. Smith , John W. Wood , Peter Groeppel
- Applicant: Gary Stevens , James D. B. Smith , John W. Wood , Peter Groeppel
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B32B27/04
Abstract:
An electrical insulation paper that is made of mica flakelets (22), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (26), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (17), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.
Public/Granted literature
- US20070141324A1 Multi-layered platelet structure Public/Granted day:2007-06-21
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