Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11653951Application Date: 2007-01-17
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Publication No.: US07847294B2Publication Date: 2010-12-07
- Inventor: Hisashi Ohtani , Tamae Takano , Shunpei Yamazaki
- Applicant: Hisashi Ohtani , Tamae Takano , Shunpei Yamazaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP10-225067 19980807; JP10-225070 19980807; JP10-255494 19980909; JP10-255495 19980909; JP10-255496 19980909; JP10-255497 19980909
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/15

Abstract:
There is provided a method in which a TFT with superior electrical characteristics is manufactured and a high performance semiconductor device is realized by assembling a circuit with the TFT. The method of manufacturing the semiconductor device includes: a step of forming a crystal-containing semiconductor film by carrying out a thermal annealing to a semiconductor film; a step of carrying out an oxidizing treatment to the crystal-containing semiconductor film; a step of carrying out a laser annealing treatment to the crystal-containing semiconductor film after the oxidizing treatment has been carried out; and a step of carrying out a furnace annealing treatment to the crystal-containing semiconductor film after the laser annealing. The laser annealing treatment is carried out with an energy density of 250 to 5000 mJ/cm2.
Public/Granted literature
- US20070117293A1 Semiconductor device and method of manufacturing the same Public/Granted day:2007-05-24
Information query
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