Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11362530Application Date: 2006-02-27
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Publication No.: US07847321B2Publication Date: 2010-12-07
- Inventor: Akito Hara
- Applicant: Akito Hara
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-054629 20050228; JP2006-015509 20060124
- Main IPC: H01L21/332
- IPC: H01L21/332

Abstract:
A semiconductor device includes a field effect transistor and a strain generating layer to apply a stress to a channel region of the field effect transistor. The strain generating layer contains at least one of oxygen and nitrogen of 1.0×1018 cm−3 to 5.0×1019 cm−3, or alternatively, the strain generating layer contains self-interstitial atoms and/or vacancies of 1.0×1018 cm−3 to 5.0×1019 cm−3. In the latter case, at least a portion of the self-interstitial atoms and/or the vacancies exist as a cluster.
Public/Granted literature
- US20060202234A1 Semiconductor device and manufacturing method thereof Public/Granted day:2006-09-14
Information query
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